Bare Die Tray

Bare Die Tray is design to facilitate the handling and storage of bare dies, ensuring optimal efficiency and protection throughout the production process. It is meticulously crafted to exacting standards, ensuring consistency and reliability. The trays are engineered to withstand the rigors of semiconductor manufacturing environments.


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  • Array capacity: 5*6 (30)
  • Unit size: 5.5*4.5.1mm


Bare Die Tray Features


  1. Material Composition : Constructed from high-quality materials such as conductive plastics or non-conductive polymers, the Bare Die Tray offers both ESD protection and durability. This ensures that delicate bare dies are shielded from electrostatic discharge, a common hazard in semiconductor environments.
  2. Precision Engineering : Each tray is precision-molded to securely hold bare dies of various sizes and shapes. The design includes pockets or slots that snugly accommodate individual dies, preventing movement and potential damage during transport or storage.
  3. Compatibility : Versatility is a hallmark of the Bare Die Tray, with options available for different die sizes and configurations. Whether handling small-scale microchips or larger integrated circuits, there exists a tray variant tailored to specific industry needs.
  4. Stackable Design : Efficiency in space utilization is achieved through the stackable design of the trays. This feature not only conserves valuable workspace but also facilitates organized storage, minimizing the risk of misplacement or loss.
  5. Ease of Handling : Ergonomically designed with handling in mind, the trays often incorporate features like integrated handles or ergonomic grips. This makes them easy to maneuver within manufacturing environments, promoting smoother workflow and reducing handling errors.


Bare Die Tray Applications


  1. Semiconductor Manufacturing : In semiconductor fabrication facilities, these trays play a crucial role in safely transporting bare dies between different stages of production, ensuring the integrity of each component.
  2. Research and Development : Bare Die Trays are instrumental in research and development labs where prototypes and experimental semiconductor designs are handled with care.
  3. Quality Control : During quality assurance processes, these trays provide a standardized method for inspecting and testing bare dies, facilitating efficient quality control checks.
  4. Assembly and Testing : In electronics assembly facilities, Bare Die Trays aid in the systematic integration of bare dies into larger electronic components, streamlining the assembly process.
  5. Storage and Logistics : Beyond manufacturing, these trays serve as a secure means of storing bare dies prior to assembly or shipment, minimizing the risk of damage or loss.


Bare Die Tray Advantages 

  1. ESD Protection : Critical for safeguarding sensitive bare dies from electrostatic discharge, the trays are designed with materials that dissipate static electricity harmlessly.
  2. Temperature Stability : Many trays are capable of withstanding a wide range of temperatures, ensuring the integrity of the bare dies during various stages of production.
  3. Cleanroom Compatibility : Manufactured under stringent conditions, Bare Die Trays are suitable for use in cleanroom environments where contamination control is paramount.
  4. Customization Options : Depending on specific application requirements, trays can be customized in terms of material composition, dimensions, and even color for easy identification and segregation.


Multiple packaging
for a wide range of applications

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