Company to debut next-generation sustainable and high-performance packaging at the premier global optics and photonics event, highlighting solutions critical for AI, quantum, and advanced semiconductor applications.

[Fuzhou, China] — December 29, 2025 — [CRYSPACK], a leader in precision and protective packaging solutions for the semiconductor and photonics industries, today announced its participation in the prestigious SPIE Photonics West 2026. The event will be held from January 17-22, 2026, at the Moscone Center in San Francisco. The company will exhibit in the newly launched Vision Tech Expo, a dedicated exhibition area focused on semiconductors, electronics, and imaging technologies.

The annual SPIE Photonics West is the world’s largest conference and exhibition for the optics and photonics industry, expected to host over 1,200 exhibiting companies and tens of thousands of professionals. CRSYPACK’s participation underscores the critical role of specialized packaging in enabling and protecting the sensitive, high-value components that drive innovation in AI, quantum computing, and advanced vision systems.

Meeting the Demands of Next-Generation Technologies

As photonic and semiconductor devices become more powerful, complex, and sensitive, their packaging requirements evolve beyond mere containment. The industry is moving towards technologies like Co-Packaged Optics (CPO), where optics and electronics are integrated into a single package, with mass deployment projected to begin in 2027. Similarly, the rise of chiplets and 3D integration places unprecedented demands on thermal management, signal integrity, and physical protection from the fabrication line to the end user.

· Focus on Vision & Sensing: At the Vision Tech Expo, CRYSPACK will present packaging solutions designed for delicate components like image sensors, 3D vision modules (LiDAR, ToF), and non-visible imaging (SWIR, UV) systems. These applications are foundational for autonomous vehicles, industrial automation, and augmented reality.

· Enabling Quantum & Biophotonics: The company’s solutions also cater to the burgeoning fields highlighted at the event, such as quantum technology and biomedical optics. Custom packaging that ensures purity, stability, and protection from environmental interference is vital for these cutting-edge applications.

· Sustainability Commitment: Aligning with global industry trends, CRYSPACK will emphasize its new line of sustainable packaging materials, designed to reduce environmental impact without compromising on the high-barrier protection required for sensitive optoelectronic components.

Visit CRYSPACK at SPIE Photonics West

Attendees are invited to experience CRYSPACK’s innovative solutions firsthand and discuss custom packaging challenges.

· Event: SPIE Photonics West 2026

· Exhibition Dates: January 20-22, 2026

· Location: Moscone Center, San Francisco, USA

· CRSYPACK Booth: #1369

For more information about CRYSPACK’s photonics and semiconductor packaging solutions, please visit www.cryspak.com.

About CRYSPACK

CRYSPACK is a global provider of high-performance, protective packaging solutions for the semiconductor, photonics, and advanced electronics industries. With a focus on innovation, quality, and sustainability, the company partners with clients to develop customized packaging that ensures the safety, integrity, and reliability of sensitive components throughout the global supply chain. From anti-static and moisture-control solutions to custom-designed protective carriers for complex modules, CRYSPACK is committed to enabling the next wave of technological advancement.