Increasing demand for Cryspack’s VR box& sticky box

Tower Semiconductor, an Israeli company that manufactures integrated circuits for sensing and communications, using silicon photonics and other semiconductor combinations, and Quintessent, which develops optical connectivity solutions to scale computing and AI applications, have announced the first heterogeneous integration of gallium arsenide quantum dot lasers and a foundry silicon photonics platform – Tower’s PH18DB.

The PH18DB platform is designed for optical transceiver modules in datacenters and telecom networks, AI, machine learning, lidar and other sensors. According to the market research firm LightCounting, the silicon photonics transceiver market is expected to grow at a CAGR of 24% reaching a total addressable market of $9 billion in 2025.

The new PH18DB platform offers GaAs-based QD lasers and a semiconductor optical amplifier based on Tower’s PH18M silicon photonics foundry technology. This platform will enable dense photonic integrated circuits that can support higher channel count in a small form factor.

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Tower claims a “world first” heterogeneous integration of quantum dot laser on its SiPho Foundry Platform PH18. 

Tower stated, “Open foundry availability of this 220nm SOI platform will provide access to a broad array of product development teams, to simplify their PIC design through use of laser and SOA pcells.”

Initial process design kits for PH18DB have been made available in partnership with DARPA under the Lasers for Universal Microscale Optical Systems (LUMOS) program, intended to bring high-performance lasers to advanced photonics platforms for commercial and defense applications. Tower added that multi-project wafers are planned for 2023 and 2024.

With the development of high technology, Cryspack expects a booming demand for its Vacuum box.

Vacuum box is formed of a vacuum release tray and a clip or a hinges box, as photo below:

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Vacuum Release Tray Applications:

● Extremely fragile or thin devices.

● Handling bare die.

● No contact with edges or top surface of device.

● Handling device sizes (X,Y) ranging from <250 micron to 75mm.

● High-volume automated device Pick & Place applications.

How to use Vacuum box?

Post time: Apr-01-2023

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