DETAILS*

Vacuum Release Carrier Features

1. Vacuum Sealing Technology: Provide a solid, secure environment free of oxygen and moisture to safeguard bare dies and MEMS devices from damage.
2. Customizable Dimensions: Available in a variety of tray sizes to suit dies, wafers and small packages.
3. Durable and Impact-Resistant Material: Made from high-strength plastic that enables quick and safe handling of fragile components.
4. Non-Contact Protection: Components are suspended within the vacuum, minimizing contact and reducing damage risk.
5. Customizable Retention Levels: To support components of different weights and sizes.
6. Visible: A clear lid lets you see the product and manage the inventory amount.

Vacuum Release Carrier Applications

1. Semiconductor Packaging: Guard fragile bare dies and MEMS from scratches during transport and handling.
2. Wafer & Die Handling: Ideal for securing thin wafers and singulated dies through process and shipping.
3. Advanced Packaging: Protect flip-chip, CSP and sensor dies used in advanced semiconductor packages.
4. Telecom & Computing: Protect fragile chips and modules in 5G, optical transceivers and compute hardware.
5. Medical Device Packaging: Protect precision semiconductor components used in medical devices during transport and storage.

Vacuum Release Carrier Advantages

1. Superior Product Protection: Reliable protection of components from damage, contamination and static discharge.
2. Saves time while loading, unloading & transportation: Smooth process of packaging and moving.
3. Versatile: Applicable to many types of semiconductor components and industries.
4. Cost-Effective: Durable and reduces damage and returns, leading to overall cost savings.

VR box configurations

• 2 inch/4 inch/ 5 inch/ 6 inch tray size based on JEDEC standard.
• Wide range of retention levels: XL, L, M, H, HH
• A wide range of mesh geometries (16, 33, 76, 103, 137, and 195)
• Print patterns can be customized