DETAILS*

VR-2 Series Vacuum Release Carrier Features

1. Vacuum Sealing Technology: Provide a solid, secure environment free of oxygen and moisture to safeguard bare dies and thin components from damage.
2. Modular Tray, Cover & Clip Design: VR-2A combines a release tray, cover and clip; VR-2B adds a hinged box for one-hand process handling.
3. Durable and Impact-Resistant Material: Made from high-strength plastic that enables quick and safe handling of fragile components.
4. Non-Contact Protection: Components are suspended within the vacuum, minimizing contact and reducing damage risk.
5. Customizable Retention Levels: To support components of different weights and sizes.
6. Visible: A clear lid lets you see the product and manage the inventory amount.

VR-2 Series Vacuum Release Carrier Applications

1. Bare Die Shipping: Guard fragile bare dies from scratches during transport and handling.
2. Thin Wafer & Substrate Handling: Secure thin wafers and substrates through process and shipping.
3. MEMS & Sensor Transport: Protect MEMS and sensor dies used in compact devices.
4. Advanced Packaging Process: Handle flip-chip, CSP and sensor dies on advanced packaging lines.
5. Medical Micro-Component Packaging: Protect precision semiconductor parts used in medical devices.

VR-2 Series Vacuum Release Carrier Advantages

1. Superior Product Protection: Reliable protection of components from damage, contamination and static discharge.
2. Saves time while loading, unloading & transportation: Smooth process of packaging and moving.
3. Versatile: Applicable to many types of semiconductor components and industries.
4. Cost-Effective: Durable and reduces damage and returns, leading to overall cost savings.

VR-2 configurations

•  VR-2A (tray + cover + clip) and VR-2B (release tray with hinged box)
• 2 inch/4 inch/5 inch/6 inch tray size based on JEDEC standard
• Wide range of retention levels: XL, L, M, H, HH
• A wide range of mesh geometries (16, 33, 76, 103, 137, and 195) 5. Print patterns can be customized