DETAILS*

VR-4 Series Vacuum Release Carrier Features

1. Vacuum Sealing Technology: Provide a solid, secure environment free of oxygen and moisture to safeguard ultra-thin components from damage.
2. Ultra-Flat Vacuum Plane: Holds the thinnest devices perfectly flat without warping or stress.
3. Durable and Impact-Resistant Material: Made from high-strength plastic that enables quick and safe handling of fragile components.
4. Gentle, Low-Stress Release: Releases ultra-thin parts without mechanical stress or residue.
5. Customizable Retention Levels: Fine-tuned to secure feather-light components of different sizes.
6. Visible: A clear lid lets you see the product and manage the inventory amount.

VR-4 Series Vacuum Release Carrier Applications

1. Ultra-Thin Die Handling: Secure sub-100µm dies through singulation and shipping.
2. Flexible & Thin Substrates: Protect flexible circuits and thin films from creasing.
3. MEMS & Sensor Wafers: Hold delicate MEMS structures without contact damage.
4. Compound Semiconductor: Suitable for GaAs, SiC and GaN delicate chips.
5. R&D and Lab Samples: Safe handling of prototype and low-volume delicate parts.

VR-4 Series Vacuum Release Carrier Advantages

1. Superior Product Protection: Reliable protection of the most delicate components from damage and contamination.
2. Saves time while loading, unloading & transportation: Smooth process of packaging and moving.
3. Versatile: Applicable to many types of thin and fragile semiconductor components.
4. Cost-Effective: Durable and reduces scrap and returns, leading to overall cost savings.

    VR-4 configurations 1. 2 inch/4 inch/5 inch/6 inch tray size based on JEDEC standard 2. Wide range of retention levels: XL, L, M, H, HH 3. A wide range of mesh geometries (16, 33, 76, 103, 137, and 195) 4. Print patterns can be customized