2019 High quality Vacuum Molding Blister Packaging - Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack

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We support our purchasers with ideal premium quality products and substantial level company. Becoming the specialist manufacturer in this sector, we've acquired rich practical working experience in producing and managing for Cosmetic Packaging Box , Plastic Transparent Membrane Box Pet , Dental Prf Box , We welcome all of the clients and friends to contact us for mutual benefits. Hope to do further business with you.
2019 High quality Vacuum Molding Blister Packaging - Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack Detail:

CrysPack developed an innovative method to pack extremely fragile or thin devices- Vaccum tray, therefore widely used in Semiconductor, Opto-electronics and Telecommunication etc. It is a prefect technology in  immobilize devices during shipping, handling and processing.  A trial use will convince you of their extraordinary functioning.
Vacuum box (VR) fixed equipment during the transportation and operation process, and when required, simple equipment will be pulled away from the tray by the release of specific equipment.

Vacuum box technology depends on changing contacting area of the surface of the elastic film in the tray. Changing surface contact directly affect the adhesive force. During the storing, operating and transportation process, the surface contact is maximized, the device is firmly fixed in the position. When the device needs to be removed , applying vacuum in a hole in the bottom of the tray, the film are in conformity with the shape of the mesh, so as to minimize surface contact.This reduces the adsorption force between film and equipment (less contact point), and easily remove equipment.


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2019 High quality Vacuum Molding Blister Packaging -
 Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack detail pictures

2019 High quality Vacuum Molding Blister Packaging -
 Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack detail pictures

2019 High quality Vacuum Molding Blister Packaging -
 Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack detail pictures

2019 High quality Vacuum Molding Blister Packaging -
 Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack detail pictures

2019 High quality Vacuum Molding Blister Packaging -
 Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack detail pictures


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We depend on sturdy technical force and continually create sophisticated technologies to meet the demand of 2019 High quality Vacuum Molding Blister Packaging - Using vacuum principle to adsorb chip CPK-VR-4B – CrysPack, The product will supply to all over the world, such as: New Zealand , Oslo , Lithuania , We are fully aware of our customer's needs. We provide high quality products, competitive prices and the first class service. We would like to establish good business relationships as well as friendship with you in the near future.
  • Sales manager is very enthusiastic and professional, gave us a great concessions and product quality is very good,thank you very much!
    5 Stars By Roberta from Argentina - 2018.05.15 10:52
    In our cooperated wholesalers, this company has the best quality and reasonable price, they are our first choice.
    5 Stars By Coral from Peru - 2018.02.08 16:45

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